This is a special preform to reball Microsoft X-Box’s “ CPU.

The solder balls are 63/37.

Microsoft recommends that its IC’s and PCB’s be reflowed or reworked to a maximum of 3 three times.

 

If after reflowing 3 times, the problem is not resloved then reballing is the only solution. This preform make reballing easy using these simple steps.

1. Remove the CPU

2. Remove the old solder using solder wick

3. Apply a thin coat of Tacky Flux 8600 to the bottom of the CPU

4. Locate the preform and align with the CPU

5. Reflow the Preform 6. Place the CPU on the board and reflow it.