Used for developing boards laminated with MG Chemicals Negative Dry Film Resist. For removing exposed resist during the negative photofabrication process.
Dilute 1 part of developer to 10 parts of room temperature water. Mix well with foam brush. Submerge exposed board into solution and brush the board gentle with foam brush. If double sided board, flip the board and to brush the other side and repeat until developing is completed. The developing process is completed once all the resist has been washed off leaving the image of your schematic on the board. Take the board out of the solution and then rinse with water. You are now ready for etching.