Sensors attached to the board allows precise temperature control at board level minimizing damage to board due to inaccurate temperature settings or overheating.
Two sensors are used as temperature control and monitoring, while an extra sensor is added to allow additional monitoring of other temperature sensitive areas of the PCB.
Digital CPU controlled systemwith easy to use digital controls and display. Uses advanced digital controls and signal processing for maximum performance, and accuracy.
Built-in overheat protection and temperature limiting. The system automatically limits the rise in temperature to industry standard 3 degrees per second. This will minimize damage to sensitive components and ensure proper reflow.
Multi-Point Board Holder and Multi-Axis Armature
Innovative board holder: Nine securing screws with four side grips to provide a secure fit for various board sizes and shapes. Effectively minimizes BGA balls shorting together due to board warping.
Top heaterfs support allows 3 degrees of freedom:Rotation of the Top heater, Swiveling of the armature, and sliding adjustments. This new design expands the effective working coverage of the unit, allowing us to access even those ICs at the edge or corner of the PCBs.
Enhanced Top and Bottom Heater
310 x 310 mm effective bottom heating area. 1500 watts of pre-heating power minimizes board warping. Utilizes Quartz Infrared technology.
The Top heater uses a square type forced convection quartz infrared technology. This new heating technology coupled with attachable double netted nozzle allows a more even temperature flow than standard hot air guns.
NOTE: This system will need a 20 Amp circuit.
Package includes: Main station, induction soldering iron, 939 vacuum pencil, soldering iron stand, spare temperature probe, nozzles:1919, 2828, 4141 and 4545
