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These are stencils for the XBox 360, PS3 and WII and they are direct heat stencils. These stencil are put right on the chip and heated with the solder balls in place. These do require cleaning after use. They are used without a reballing station.

(i) Used with 0.50mm solder ball (1 PCS)
     WII    CPU (New version)
(ii) Used with 0.60mm solder ball (18 PCS)
    CXD2949CGB
    CXD2964GB
    CXD2973GB
    CXD2976GB
    CXD29808GB
    CXD2992GB
    CXD9833GB
    PS3    GPU
    PS3    CPU (New version)
    PS3    CPU (Old version)
    PS3    CXR714120
    WII    GPU (New version)
    WII    GPU (Old version)
    WII    CPU (Old version)
    XBOX360 GPU
    XBOX360   CPU
    XBOX360   CSP
    XBOX360   HANA
(iii) Used with 0.76mm solder ball (1 PCS)
     CXD9799GB

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