These are BGA stencils for cell phones and laptop and they are direct heat stencils. These stencil are put right on the chip and heated with the solder balls in place. These do require some cleaning after use. They are used without a reballing station.
The package contains the following:
(a) Used with 0.3mm Solder Ball (2pcs)
82801IUX
0.3mm universal stencil (pitch = 0.5mm) (20 * 20mm)
(a) Used with 0.35mm Solder Ball (2pcs)
82HM55//GM55
0.35mm universal stencil (pitch = 0.65mm) (20 * 20mm)
(b) Used with 0.4mm Solder Ball (4pcs)
82P45//G41
82P55
82PM45//GM45
0.4mm universal stencil (pitch = 0.7mm) (29.5 * 29.5mm)
(c) Used with 0.45 Solder Ball (4pcs)
DDR1
DDR2
DDR3//XBOX360 Universal Stencil
0.45mm universal stencil (pitch = 0.8mm) (29.5 * 29.5mm)
(d) Used with 0.5mm Solder Ball (37pcs)
200M RC415ME
215-0308003//0743SSP
215-0669065
215-0719090
215-0735003
215RGMDKA13FG
218-0697010
21514//M72-M//M74-M
21515//M64-S//M72-S//M82-S
216-0728020//0725013//0725007
307ELV
6100//8200//8300//8400
7200//7300//7400//G84-630-A2
915GMS
945GM//PM
945GMS//GSE
945P//GC//PL
965GM//PM
965P//G31
ATI1100//RS485M//RS485MC
BR03-N-A3
BR04-300-A2
G200-103
G94-300-A1//G94-210-A1
G96-600-A1//G98-600-A1
GF104-325-A1
IXP460
IXP600//SB600
