Tin & Solder Stripper is an acidic, ferric nitrate based solder stripper designed for use in printed circuit board fabrications for removal of solder and tin deposits from copper substrates. It can be use to ensure a clean, solder free surface for subsequent plating and other processing operations. 

It is designed to be used in immersion or spray applications. Tin & Solder Stripper provides minimal sludge generation during operation and a low copper attach rate. It is easily waste treated and contains no hazardous fluorides, fluoborates, or peroxides. It operates at room temperature for ease of use and reduction of corrosive vapors. 

Specifications

Operating Conditions

Temperature 27 °C (80 °F)            21°C - 35 °C (70 - 95 °F)

Dwell Time*(immersion) 3 minutes           1 – 5 minutes

Dwell Time* (spray) 1 minute   20 seconds – 2 minutes

*Dwell times are based on a nominal thickness of 0.3 mil (7.6 micron) of tin or tin/lead

Agitation – Mechanical for immersion operation

                 Oscillation is recommended in spray applications

NOTE: This can only be shipped by ground!!